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NEWS
Mipox will participate in "SEMICON TAIWAN 2026."
August 26th, 2026
Mipox will participate in "SEMICON TAIWAN 2026," an exhibition to be held in Taiwan from Wednesday, September 2 to Friday, September 4, 2026, as part of Kanematsu Taiwan Corporation's booth.
We will be showcasing our contract processing services for semiconductor wafers. We look forward to your visit to the booth.
| Exhibition Name | SEMICON TAIWAN 2026 |
|---|---|
| Date | September 2 to 4, 2026 |
| Location | Taipei Nangang Exhibition Center, Hall 1 No. 1, Jingmao 2nd Rd, Sanzhong Village, Nangang District, Taipei City, Taiwan |
| Booth No | No. L1007, within Kanematsu Taiwan Corp.'s booth |
| official site | SEMICON TAIWAN 2026 |
▲Image of Kanematsu Taiwan Corp.'s Booth
What We're Exhibiting
CMP
Mipox planarization polishing / CMP supports a broad range of processing applications, from various wafer (substrate) surface polishing to CMP of insulating films, metal films, and resin films. Processing capabilities cover substrate sizes ranging from small pieces and chips up to SEMI-standard 12-inch wafers.
Room-Temperature Wafer Bonding
Mipox's room temperature bonding service handles projects combining silicon wafers, compound semiconductor wafers, oxide wafers, ceramic material wafers, and others, with a focus on prototyping for power semiconductor applications, surface wave filter applications, high frequency devices, various MEMS and LED applications.
Edge and Notch Polishing Service
Utilizing Mipox's proprietary film polishing technology, this system enhances the edge quality of various semiconductor wafers. It enables the precise removal of surface oxides and abnormal epitaxial growth, while providing full control over edge profile geometries.
CONTACT
Mipox, the polishing professional, will propose the best polishing solutions, materials, and tools to meet your needs.
Please feel free to contact us.