Mipox's Coring / Resizing

An appropriate cutting method is selected according to the state and application of an individual wafer. Low damage and high-quality resizing is offered.

• Coring / Resizing
• Chamfering
• Terrace Processing
• Process Flow

Wafer Coring / Size Reduction

We handle not only device-attached silicon wafers, but also compound semiconductors such as SiC wafers.
In addition, we also handle special format size reduction for such wafers as irregularly shaped wafers (half-inch wafers, chip shaped wafers).

From small lots for research and development applications to medium volume production - we handle a wide variety of wafer size reduction processes.

[Size reduction method]
• Laser cutting
• Waterjet cutting
• Abrasive grinding method (such as blade, mounted grinding wheel, and core drill methods)
• Others

Chamfering after Resizing

Wafer edges and notches after resizing are very easily damaged, with many cutting marks of some kind remaining.

Mipox adopts a chamfering technique based on its proprietary polishing film method. Through low damage to wafers and adjustment to appropriate shapes and edge surface roughness, Mipox greatly contributes to yield improvement in the operation of resized wafers.

Notch polishing example

Terrace Processing

Taking advantage of one of the characteristics of the polishing film type polishing method - low damage to wafers, Mipox also handles wafer terrace polishing services.

Without causing damage to the epitaxial layer of a wafer with membranes such as GaNonSi, unnecessary membranes (unnecessary sections) can be removed and a mirror surface can be achieved. This process contributes to yield improvement in wafer manufacturing lines using the above type of wafer.

Process Flow

From acceptance inspection of wafers to surface protection (resist coating), cutting (coring), edge polishing, cleaning, and inspection - Mipox handles all the processes as a one-stop service.

Edge and Notch Polishing Service

Mipox's One-Stop Solution

Silicon Wafers

Compound Semiconductor Materials (Next-Generation Semiconductor Materials)

Fine Ceramics (Polycrystalline, Sintered, and Composite) Materials

Effective Edge Polishing Film for GaNonSi Challenges