Requirements for Fine Ceramics (Polycrystalline, Sintered, and Composite) Material Processing

Fine ceramics possess various characteristics such as thermal dissipation properties and toughness, and are used in a wide range of applications. Mipox's contract polishing services provide superior surface precision (polished surface roughness, surface step elimination) that minimizes crystal grain boundary steps on the topmost surface for various fine ceramic substrates. For fine ceramic materials that tend to develop increased surface roughness due to exacerbated crystal grain boundary steps during conventional polishing processes, we can achieve a precision of Sa (Ra) 1.0 to 0.1 nm (or even lower). This enables direct bonding with heterogeneous materials and void-free bonding, potentially leading to the realization of hybrid substrates with novel functions and performance depending on the combination. Additionally, it contributes to reducing the burden on thin film deposition processes (by reducing the required film thickness) and creating new applications for each material.

Materials ：
AlN, Si3N4, SiC, Al2O3, ZrO2, BaTiO3, PZT, Si, Al2O3/YAG eutectic, etc.

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