Silicon Wafers｜Mipox PRODUCT

Table of Contents

Requirements for Wafer Edge Processing
Prime Wafer Manufacturing Applications
Device Manufacturing (Back-End) Applications
Reclaim Applications

Requirements for Wafer Edge Processing

Mipox's contract polishing services cater to edge-related processing needs for silicon wafers used in semiconductor and various sensor manufacturing. Our services span from prime wafer manufacturing processes to device wafer manufacturing processes (front-end, mid-end, and back-end), as well as reclaim (regenerated wafer) applications.

Materials ：
Si, various silicon wafers, various bonded wafers, SOI, device wafers (patterned wafers), reclaimed wafers, etc.

Prime Wafer Manufacturing Applications

We handle a range of processes, from basic edge chamfering on as-sliced wafers to removing unwanted films from edge areas after CVD deposition (as an alternative to masking and HF etching), eliminating grinding marks (damage) in notch areas, and forming terraces on wafer peripheries.

Our "polishing film-based edge polish" process, which significantly reduces the load on the edge CMP process (slurry-based edge mirror process), is a notable application with extensive adoption in mass production lines as an intermediate step.

Device Manufacturing (Back-End) Applications

We offer one-stop solutions from protective film (backgrinding tape) application to edge trimming, which is effective in preventing wafer breakage during the thinning and backgrinding (BG) process. Our services extend through BG, cleaning, tape removal, dicing, and tray packing. We also accommodate special requests such as edge repair of non-alkaline glass support substrates used in thinning processes and edge chamfering after BG (to prevent breakage of thinned wafers), which is in high demand for power semiconductor applications.

Reclaim Applications

In silicon wafer reclamation, carbon-based films that are difficult to remove by conventional etching methods, or epi-layers that are time-consuming to remove, can be problematic. Mipox's contract polishing services apply a proprietary polishing film-based film removal method, ready for mass production.

We also offer an "etching assist treatment" that improves the efficiency of etching-based film removal by adding minute strains (damage) to the film surface.