Wafer Edge Polisher

Wafer Edge Polisher

The best yield solution for all kinds of substrate edge polishing.

Product Shape

Machinery and Equipment

Applications

Semiconductor,Electronics,PCB & Electronic Devices,Polishing Equipment
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Product Features

Our unique polishing technology by using abrasive tapes realizes constantly polishing capability with a new abrasive surface without being clogging, in various materials of wafer edge (beveling/notch/top edge) polishing.

-Sales record of over 200 wafer edge polisher all over the world.
-Applicable for various sizes, from half-inch to 450mm wafer.
-Proven edge processes such as beveling and polishing (controling surface roughness) and forming the edge shape (preventing the shape of knife edge).
-Superior removing method of films (insulation films, metal films) and organic substances such as resins, residues, etc. on the edge.
-High-efficiency with low damage beveling and polishing of SiC wafers.

Product Line-up

Edge shape processing
Notch polishing
Bevel Polishing


Track record

Si,SiC,GaN,InP,GaP,GaAs,Ga2O3,GaSb,ZnS,ZnTe,GaNonSi,GaNonSiC,SiConSi,SiConSiC,AlN,Si3N4,Al2O3,ZrO2,BaTiO3,PZT,Si,Al2O3/YAGeutectic,LiTaO3（LT）,LiNbO3（LN）,glass

Oxide film, Nitride film, Epitaxial film, Au film, Cu film, Al film

Edge Polisher Movie

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Mipox, the polishing professional, will propose the best polishing solutions, materials, and tools to meet your needs.
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