Probe Card Cleaning Sheet
Probe Card Cleaning Sheet
Our Cleaning Sheets have a large lineup to meet all needs.
In the wafer inspection process of semiconductor front-end processing, it is important to maintain the cleanliness and shape of dedicated testers at a constant level in order to reduce the risk of defective wafers. In the worst case, the accuracy of the wafer inspection process can deteriorate to the point where wafer inspection must be interrupted or the dedicated tester replaced for an extended period of time. Mipox cleaning sheets are effective in cleaning and shaping these dedicated testers.
Product Shape
Applications
Cleaning Sheet Type
PET
Lapping PET film with adhesive.
Suitable to remove stubborn adhere.
-Total thickness: 115μm
-Recommended heat resistance: 120℃
-Reference OD amount: 30μm
-Pin tip wear resistance: high
SWE
Abrasive layer formed on uneven cushion surface.
Higher efficient cleaning with low wear.
-Total thickness: 450μm
-Recommended heat resistance: 120℃
-Reference OD amount: 50μm～80μm
-Pin tip wear resistance: Low
*Low chlorine type sheets (FHX), heat resistant film type sheets (SWF), and sheets with small urethane pores (NWE) are also available.
PF3
Abrasive layer formed on flat cushion surface.
Higher efficient cleaning with low wear.
-Total thickness: 300μm
-Recommended heat resistance: 120℃
-Reference OD amount: 30μm～50μm
-Pin tip wear resistance: Low
BC3
Lapping film with cushion adhesive tape.
Higher efficient cleaning with low wear.
-Total thickness: 410μm
-Recommended heat resistance: 80℃
-Reference OD amount: 30μm～50μm
-Pin tip wear resistance: Low
LUAVIS
LUAVIS is mixed abrasive uniformly within silicone elastomer.
By using elastomer as cleaning layer, a probe tip cleaning is done without damage or deform and, also LUAVIS supports for various probe tip types.
-Total thickness: 400μm
-Recommended heat resistance: 160℃
-Reference OD amount: 60μm～80μm
-Pin tip wear resistance: Low
*The operating environment temperature is recommended.
Pin’ｓ Shape
Our cleaning sheets can be used to clean and sharpen probe pins for probe cards and sockets used in semiconductor test processes.
he probe pins to be cleaned include vertical/round (R-shaped or bullet-shaped)/needle/pogo/crown/MEMS, etc.
-Vertical pin
This probe has a flat tip, so it is suitable for PET/PF3/BC3 sheets with a flat surface.
-Round pin/Needle pin/MEMS
These probe pins have rounded tips, so PF3/BC3, which has a flexible sheet surface and contacts from the tip to the side, is suitable.
-Pogo pins/crown pins
These probe pins have serrated tips, so SWE, NWE and SWF are suitable for cleaning from the tip to the sides.
Application
with wafer, grinding board, WAPP
Probetester
other services
CONTACT
Mipox, the polishing professional, will propose the best polishing solutions, materials, and tools to meet your needs.
Please feel free to contact us.