Abrasives for Printed Circuit Boards/Abrasives for Automotive Components (FSP/TLF)
Abrasives for Printed Circuit Boards/Abrasives for Automotive Components (FSP/TLF)
Our PCB and automotive abrasives can meet a wide range of customer requirements and are trusted for high quality polishing. Special sizes can also be considered, so please do not hesitate to contact us.
Product Shape
Applications
Product Features
Abrasives for Printed Circuit Boards/Abrasives for Automotive Components (FSP、TLF)
FSP-WM4L5/5LS: Ceramic wheel with abrasive particles arranged in a three-dimensional structure. It eliminates hole dropouts and unevenness in polishing and ensures a uniform finished surface.TLF: Ceramic wheels with abrasive grains arranged in a three-dimensional structure. The self-regulating action of the abrasive grains within the pellet resin reduces clogging and provides excellent grinding performance.
Product Line-up
Application explanation
Grinding to remove pre-preg resin.Surface grinding of stainless steel sheets.Removal of rough spots after plating.Removal of hole filling paint.Deburring after drilling.Other applications
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CONTACT
Mipox, the polishing professional, will propose the best polishing solutions, materials, and tools to meet your needs.
Please feel free to contact us.