Mipox established an edge treatment method of diamond substrates with our own abrasive films. We will contribute to mass production of the diamond semiconductors, which are expected to become the ultimate power semiconductor.

Our polishing service is suitable for a R&D and medium volume production in the semiconductor industry.We can deal various materials in the semiconductor industry, such as monocrystaline wafers, compound wafers, polycrystaline wafers, bonding wafer and electroceramics. We can provide a surface polishing/CMP service of patterned and unpatterned wafers. we also focus on the edge polishing for semiconductors. Our edge polishing method, tape edge poishing(hereinafter TEP) is different from chemical edge polish and edge trimming by grinding. The features and objectives of TEP are as below

The features of TEP
-beveling and mirror polish for wafer edge
-using abrasive film manufactured by Mipox
-invented and developed by Mipox
-Physical action by abrasive grains

The objectives of TEP
-roughness improvement
-edge shape arrangement
-advanced measures of handling accidents
-structural strength for preventing chipping and crack
-measures of foreign materials
-yield ramp for manufacturing silicon wafers (Edge polishing with abrasive film is well-known process for manufacturing silicon wafer)
-stable outcome of lapping and polishing

We provide a variety of applications leveraging the abrasive films. As part of TEP applications, we established mechanochemical edge polishing for diamond substrates. The processing results are as below.

The achievement:
-mechanochemical polishing (physical action and chemical action)
-chips of monocrystalline diamond
-beveling and edge shape arrangement
-Mirror polish
-Chipping removal

We have been receiving inquiries around the world because few companies offer the appropriate polishing for monocrystalline diamond substrates. Our new process contributes to the yield improvement.

Mipox is a leading edge company that has the expertise and experience in precise polishing. We offer innovative polishing solutions by our own abrasives and in-house equipment (polishing, cleaning and inspection devices etc.). We are working on not only the semiconductors but also the hard materials to polish, next generation materials and diamonds.
Please contact us for more information.
→https://www.mipox.co.jp/en/en_inquiry.html