Precision Polishing Services

Mipox's contract polishing service mainly serves the semiconductor industry, where the company receives wafers and other materials from customers and performs polishing processing using its own equipment (polishing machines, cleaning machines, inspection equipment) and proprietary polishing media to meet customer requirements.

Planar Polishing(CMP)& Slurry

Edge and Noch Polishing Process

Room-Temperature Bonding

Wafer Coring & Resizing ＆ Dicing

Wafer Making

Precision Cleaning

Process Development and Technology Transfer

Contract Polishing Process Flow

Inquiry

Accepted through the website contact form.

Consultation

Our sales representatives or technical department staff will discuss your requirements.
Confidentiality agreements will be signed according to project content and circumstances.

Specification Definition

Discussion of complete processing specifications.
May occur after prototyping and evaluation in some cases.

Prototyping & Evaluation

Processing (prototyping) conducted according to contracted content and specifications.

Mass Trial Production

Specifications determined based on trial results.
System established to meet quality, delivery, and cost requirements.

Contract Agreement

Start of Mass Production

Process Development and Transfer Flow

Inquiry

Received through the contact form on the website.

Consultation

Discussion with our sales or technical staff.
Confidentiality agreement signing as needed.

Prototyping and Evaluation

Processing trials according to specifications.

Specification Definition

Equipment and processing conditions are determined based on the consultation.

Process, Equipment & Technology Transfer

Transfer of polishing technology, equipment, and materials to customer's manufacturing line.Support through startup.

Ongoing Support

Continuous supply of abrasive materials and consumables.Technical support.

Processing Equipment List

Equipment	Wafer Size (Inch)	Auto Type	Feature
Edge Polishing Machine	18", 12" to 2", and Half Inch (SEMI standard sizes)	Fully Automated	Polishing film method
CMP Equipment	12" to 4" (Manual support for 3" and above)	Semi-Automatic	Surface polishing
Single-Sided Lapping Machine	6" to 2", Half Inch, and small chip sizes	Manual	Surface polishing
Single-Sided Grinding Machine	12" to 2", Half Inch, and small chip sizes	Semi-Automatic	Surface grinding
Scrub-Type Wafer Cleaning Machine	18" (450mm), 12" to 6"	Semi-Automatic	Brush cleaning
Megasonic Wafer Cleaning Machine	6" to 2", and Half Inch	Manual	Ultrasonic bath cleaning
Wafer Dicing Machine (Size Reduction)	12" to 2", and Half Inch	Manual	Laser and blade methods
Laser Marking Equipment	12" to 2"	Manual
Long Filler Bar Polishing Equipment	ー	Fully Automated	Superconductor wire polishing

450mm Edge Polishing Equipment

MAT CMP 200mm Surface Polishing Equipment

SFF-200TX Edge Polishing Equipment

Sales Equipment List For More Details

Inspection Equipment List

Equipment	Wafer Size (Inch)	Auto Type	Feature
Micro-Max VMW	12" to 2", Half Inch, and small chip sizes	Manual	Wafer edge defect inspection
Micro-Max VMX6100	8" to 2", Half Inch, and small chip sizes	Manual	Wafer surface defect inspection
Micro-Max XS-1	6" to 2", Half Inch, and small chip sizes	Manual	Transmission dislocation visualization
VDM-5000 Ultima (Defect Inspection)	4”	Manual	Automated wafer surface defect inspection
KLA-TENCOR P-10	12" (limited conditions), 8" to 2", Half Inch, and small chip sizes	Semi-Automatic	Stylus-type profiler
ZYGO NewView 7100	12" to 2", Half Inch, and small chip sizes	Semi-Automatic	Non-contact surface roughness and shape measurement
NANOSPEC AFT5000	12" to 2", Half Inch, and small chip sizes	Semi-Automatic	Optical interference film thickness measurement
Sheet Resistance Meter	12" to 2", Half Inch, and small chip sizes	Manual	Metal thin film thickness measurement
NanoNavi L-trace Ⅱ	8" to 2", Half Inch, and small chip sizes	Semi-Automatic	Atomic force microscope (surface roughness measurement)
Edge Profiler	12" to 2", Half Inch, and small chip sizes	Manual	Edge shape measurement

Micro Edge

Micro-Max XS-1

VDM-5000 Ultima

Go To Inspection Equipment

One-Stop Semiconductor Wafer Manufacturing Solution

One of Mipox's core technologies is "polishing," and we provide a "one-stop solution service" centered on semiconductor wafer applications using our precision polishing technology. We handle prototyping, development applications, and small to medium-volume production.

By managing all wafer manufacturing processes (such as polishing processes) in-house, we arrange rational manufacturing processes. We meet customer requirements with appropriate quality and delivery times.

Common Customer Challenges

Need to request quotes for each process separately

Optimal precision for each manufacturing process is unclear

Uncertainty about optimal precision for each manufacturing process

Mipox's One-Stop Solution

Mipox proposes optimal manufacturing processes.
We arrange manufacturing processes utilizing internal and external resources to meet customer requirements, proposing appropriate processes.
Customers can obtain finished products (wafers, etc.) that meet their requirements with a single request.

Typically, when considering outsourcing semiconductor wafer manufacturing, complicated tasks such as quote requests, delivery time adjustments, and schedule management are required for each contractor existing in each manufacturing process.
Mipox's one-stop solution manages all of these, reducing customer burden and arranging rational manufacturing processes from quality, delivery time, and cost perspectives.

Planar Polishing(CMP)

We offer a wide range of services from planar polishing of various wafers (substrates) to CMP of insulating films, metal films, resin films, etc.

Edge /Notch Polishing

Our unique film polishing method can be used for a wide range of applications from chamfering to mirror finishing, removal of unwanted films, edge cleaning, etc.

Precision Cleaning

Handles a wide range of cleaning, from general RCA cleaning to chemical cleaning with special agents and physical scrub cleaning.

Room Temperature Bonding

Achieves high-quality bonding by combining lapping and cleaning processes.

Q&A on Polishing Services

We primarily handle edge polishing, surface polishing, and CMP. Additionally, we provide one-stop solution services that handle multiple processes together, including resist coating (wafer surface protection), size reduction processing, and precision cleaning.

We handle special size wafers beyond SEMI standards. We flexibly accommodate square substrates, chip-shaped substrates, fan-shaped pieces, half-inch sizes, etc. Please consult us about your desired sizes and shapes.

Depending on the request, we can handle same-day turnaround in some cases.
Example:
Edge trimming of device wafers: Same-day
Surface polishing of ceramic substrates: Approximately 1 week
Wafer making from ingot: Approximately 1 month

We provide appropriate documentation according to requirements. Please discuss during initial specification review.

Timeframes vary depending on content, quantity, difficulty, and current workload. Typical processing times: