Mipox flexibly supports various semiconductor wafers (SEMI standard sizes), special format size wafers, glass substrates, and bonded composite wafers. We have extensive experience with challenging materials including SiC, GaN, diamond, oxide materials, and various ceramic materials.

• Wafer Polishing Process
• Edge Polishing and Chamfering
• Edge Trimming
• De-filming Process
• Cleaning Process
• Compound Semiconductor Chamfering
• Terrace Forming and Polishing
• Non-standard Chamfering
• Removal of Misalignment
• SiC 8-inch wafer
• Cost Example

Wafer Polishing Process

Leveraging the film's unique characteristics of "flexibility" and "continuous abrasive replacement", we have independently developed a high-efficiency process that achieves both low damage and high polishing rates, expanding this into our polishing service. By selecting the appropriate polishing film, we can easily process challenging materials like SiC and GaN.

Moreover, our polishing service is utilized not only in wafer manufacturing processes but also in semiconductor "post-processing" applications. Particularly, our uniquely developed "Edge Trimming Process" is a key application designed to prevent wafer damage during backgrinding (BG), with the ability to simultaneously remove the wafer and BG tape. (Japanese Patent No. 4463326)

Edge Polishing and Chamfering

Mipox's edge polishing service (film-based edge polishing) can handle challenging materials that are difficult to process using grinding wheel or slurry polishing methods. We can finish edge shapes and edge/notch surface roughness to your desired shape and precision.

Film Polishing Method Strengths

Adaptable to Low-Volume, Diverse Configurations

Can modify edge shapes through equipment settings (recipes). Unlike typical grinding methods, no need to prepare specific grinding wheels for each edge shape, enabling flexible response to low-volume, diverse edge shape requirements.

Easy Surface Roughness Adjustment

By changing polishing film type, edge/notch surface roughness can be easily modified and adjusted.
Capable of achieving mirror finish down to 10nm through repeated polishing.

Significantly Reduced Chipping
Dramatically fewer micro-cracks compared to grinding methods. Suitable for delicate template substrates like GaNonSi.

Chemical-Free Process
No liquid chemicals (acids, alkalis) used during edge polishing, eliminating wafer cleaning and waste liquid processing steps.

High Efficiency for Difficult Materials
Achieves 3-5 times higher chamfering processing efficiency for materials like SiC and GaN compared to grinding methods.

Material Versatility
Can smoothly polish plastic and metal materials (Cu film, Au film) that grinding methods struggle with.

Edge Trimming Processing   
Preventing Wafer Damage During Thinning

General backgrinding (BG) situation without edge trimming

Edge-trimmed wafers using the polishing film method

Mipox's edge trimming service improves yield in semiconductor wafer backgrinding processes.
It can process edge areas with various resin or metal films (Cu, Au) without interference. Additionally, it can simultaneously trim the backgrinding tape and wafer, allowing processing after tape application without disrupting existing workflows.

Reclaimed Wafer Applications - Edge/Notch Membrane Removal

The edge/notch polishing service minimizes wafer diameter reduction while efficiently removing unwanted films and defects. This is particularly effective for wafer reclaiming markets, including:

• Removing carbon-based films difficult to etch chemically
• Restoring wafers with severe surface irregularities
• Supporting large diameter SiC (8-inch) wafer reclamation

Edge/Notch Cleaning Process

The polishing method effectively resolves resin (adhesive) attachment issues during:

• Composite wafer manufacturing
• High-bump backgrinding tape processes

Unlike grinding or slurry methods, the film-based approach is less susceptible to material-induced clogging, enabling efficient resin removal.

Compound Semiconductor and Oxide Material Processing

Mipox's edge and notch polishing service (polishing film edge polishing) is widely used for chamfering compound semiconductor wafers such as SiC and GaN, as it is recognised for its low damage to the wafer compared to other methods.

Recognized for low-damage processing, the method is widely used for:
-Chamfering SiC and GaN semiconductor wafers
-Complementing water-assisted laser cutting techniques
-Particularly effective for 8-inch SiC and ceramic material wafer fabrication

Top Edge Polishing and Terrace Formation

Chip-Shaped and Non-Standard Wafer Processing

Wafer Bonding Alignment Correction

The edge that protrudes due to misalignment caused when bonding two wafers of different materials is intensively polished to restore the wafers to an almost perfect circular shape.

Can correct misalignments during dissimilar material wafer bonding by:
-Selectively polishing protruding edges
-Restoring near-circular wafer shape
-Maintaining underlying wafer structure

Large Diameter 8-inch SiC Wafer Processing

Cost Comparison

Chamfering using the abrasive film method offers better cost performance than other methods, especially for difficult-to-machine materials.
A comparison of chamfering costs for single crystal 8-inch wafer applications (chamfering by abrasive film and grinding wheel method) is shown in a separate graph.

The abrasive film method enables chamfering to be carried out at a lower cost. In particular, the chamfering of notches is an overwhelmingly low cost, approximately 1/5 that of the grinding wheel method.　In addition, the abrasive film method is also superior in terms of uptime, as it minimises equipment downtime, such as when changing abrasive materials.

Film-based polishing offers superior cost performance, especially for challenging materials:
-Significantly lower cost compared to grinding methods
-Approximately 1/5 the cost for notch area processing
-Reduced equipment downtime
-Higher operational efficiency

CONTACT

Mipox, the polishing professional, will propose the best polishing solutions, materials, and tools to meet your needs.
Please feel free to contact us.

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