Requirements for Processing Various 3D Printed Structures

Currently, several mainstream 3D printing methods exist, including the FDM (Fused Deposition Modeling) method using filaments, the inkjet method using UV-curable resins, and the powder sintering method. However, regardless of the method, the phenomenon of "layer lines" remaining on the surface of the printed structure is unavoidable, which degrades the texture quality of the printed object. Mipox's contract polishing service offers surface planarization processing for 3D printed structures using our proprietary abrasive "TuneD3", developed specifically for 3D printed objects. This service flexibly accommodates various printing methods and materials. Through our polishing process, we enhance the value of your precious printed structures (creations).

Materials :
ABS, PLA, Polyamide (Nylon), ULTEM, Ti, SUS, etc. All shapes accepted

Related Articles

Silicon Wafers

Silicon Wafers

Compound Semiconductor Materials (Next-Generation Semiconductor Materials)

Compound Semiconductor Materials (Next-Generation Semiconductor Materials)

Fine Ceramics (Polycrystalline, Sintered, and Composite) Materials

Fine Ceramics (Polycrystalline, Sintered, and Composite) Materials

GaNonSi Challenges

Effective Edge Polishing Film for GaNonSi Challenges

CONTACT

Mipox, the polishing professional, will propose the best polishing solutions, materials, and tools to meet your needs.
Please feel free to contact us.