Requirements for Processing Various Metallic Materials

Mipox's contract polishing service is capable of achieving Chemical Mechanical Planarization (CMP) with a surface roughness (Ra) of less than 1nm on metallic materials that are generally considered difficult to polish to a high-quality surface finish, such as gold (Au), aluminum (Al), and molybdenum (Mo). In particular, for Au and ruthenium (Ru), we have established CMP processes for semiconductor manufacturing (metallization processes) using our proprietary polishing methods. We have also accumulated extensive processing experience for various applications, including medical sensors (for biotech applications) and microelectromechanical systems (MEMS).
For more common applications, we have numerous cases of polishing tungsten carbide (WC) components and stainless steel (SUS) materials used in inkjet nozzle manufacturing. Notably, for SUS materials, we possess specialized polishing techniques that can achieve a scratch-free mirror finish on foils as thin as tens of microns.

Materials ：
Stainless steel (SUS), copper (Cu), aluminum (Al), gold (Au), platinum (Pt), ruthenium (Ru), molybdenum (Mo), nickel (Ni), silver (Ag), titanium (Ti), tungsten (W), iron-nickel alloy (Fe-Ni), as well as nickel-phosphorus (Ni-P) and chromium (Cr) plated surfaces, etc.

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